The proceedings of the workshop are available through Open Proceedings at this link :


The workshop program can be downloaded : ERMAVSS_Program.


Invited Talks

Accuracy versus Breadth in Cross-Layer Solutions

Robert C. Aitken is an ARM Fellow and technology lead for ARM Research. His areas of responsibility include technology roadmapping, library architecture for advanced process nodes, and low power design. His research interests include design for variability, resilient computing, and memory robustness. His group has participated in numerous chip tape-outs, including 8 at or below the 16nm node. He has published over 70 technical papers, on a wide range of topics.  Dr. Aitken joined ARM as part of its acquisition of Artisan Components in 2004. Prior to Artisan, he worked at Agilent and HP.  He has given tutorials and ...

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Reliability and Variability in CMOS Devices

As FET devices scale toward ~10 nm gate lengths, the discreteness of matter and the particular arrangement of individual atoms in each device result in increased time-zero variability. Moreover, degradation mechanisms, such as TDDB and BTI, can be traced to as-fabricated and generated defects in the gate oxide. Since literally only a handful of defects will be present in each deeply scaled device, while the behavior of these defects is typically stochastic, voltage and temperature dependent, and widely distributed in time, each device will be behaving differently during operation, resulting in additional, time-dependent variability. We will argue that reliability and ...

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Reliability Challenges for Large ASICs

In this talk, Yongsheng Sun(孙 永生), will introduce HiSilicon (海思) and describe their cutting edge products. HiSilicon is one of the largest fabless companies and currently ships chips in the most advanced process technologies. Due to their success and huge number of products being shipped, reliability is a top concern. Sarinda Wang will describe the key challenges when designing highly reliable, silicon intenstive products. Specific issues will also be discussed to sensitisize the audience to the real-world reliability problems faced when shipping products in the most advanced technologies. About the Speaker Yongsheng Sun received the B.S and M.S degree in Microelectronics from the University of Electronic ...

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Reliability and Safety Challenges of Automotive Devices

Summary Recent years, to enhance automotive functionalities for more driving enjoyment and hazard prevention, more and more electronic devices are used to monitor and control automotive operation. To ensure the safety of drivers and passengers, these electronic devices need higher reliability. In this talk, we will present what Mentor Graphics are doing to prepare for these reliability and safety challenges in pre-silicon, post-silicon and system operations.   About the Speaker Wu-Tung Cheng is a Chief Scientist and Advanced Test Research Director in Mentor Graphics. He is an IEEE fellow since year 2000. He has over 150 publications and 50 patents in semiconductor manufacture test and diagnosis area. In 2006, ...

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Aging on RT Level – Analysis and Monitoring

Traditionally, aging of ICs was investigated by reliability departments and resulted in an overall guardband factor which needed to be considered during IC design. This approach is increasingly less appropriate. Transistor-level aging models, however, are not suitable for analyzing large circuits. Therefore, gate level timing models incorporating aging have been developed. We will show aging information can be abstracted further from gate to RT level – without loss of accuracy. We will also discuss how such RT level timing models can be employed to monitor the aging of digital circuits during their operation. About the Speaker Ulf Schlichtmann spent about 10 years ...

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