The proceedings of the workshop are available through Open Proceedings at this link :


The workshop program can be downloaded : ERMAVSS_Program.


Invited Talks

The Resilience Wall: Cross-Layer Solutions

Summary Resilience to hardware failures is essential for a large class of future computing systems that are constrained by the so-called power wall: from embedded systems to supercomputers. To overcome this major challenge, we advocate and examine a cross-layer resilience approach. Two major components of this approach are: 1. System- and software-level effects of circuit-level faults are considered from early stages of system design; and, 2. resilience techniques are implemented across multiple layers of the system stack – from circuit and architecture levels to runtime and applications – such that they work together to achieve required degrees of resilience in a ...

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Reliability and Safety Challenges of Automotive Devices

Summary Recent years, to enhance automotive functionalities for more driving enjoyment and hazard prevention, more and more electronic devices are used to monitor and control automotive operation. To ensure the safety of drivers and passengers, these electronic devices need higher reliability. In this talk, we will present what Mentor Graphics are doing to prepare for these reliability and safety challenges in pre-silicon, post-silicon and system operations.   About the Speaker Wu-Tung Cheng is a Chief Scientist and Advanced Test Research Director in Mentor Graphics. He is an IEEE fellow since year 2000. He has over 150 publications and 50 patents in semiconductor manufacture test and diagnosis area. In 2006, ...

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Accuracy versus Breadth in Cross-Layer Solutions

Robert C. Aitken is an ARM Fellow and technology lead for ARM Research. His areas of responsibility include technology roadmapping, library architecture for advanced process nodes, and low power design. His research interests include design for variability, resilient computing, and memory robustness. His group has participated in numerous chip tape-outs, including 8 at or below the 16nm node. He has published over 70 technical papers, on a wide range of topics.  Dr. Aitken joined ARM as part of its acquisition of Artisan Components in 2004. Prior to Artisan, he worked at Agilent and HP.  He has given tutorials and ...

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Reliability Challenges for Large ASICs

In this talk, Yongsheng Sun(孙 永生), will introduce HiSilicon (海思) and describe their cutting edge products. HiSilicon is one of the largest fabless companies and currently ships chips in the most advanced process technologies. Due to their success and huge number of products being shipped, reliability is a top concern. Sarinda Wang will describe the key challenges when designing highly reliable, silicon intenstive products. Specific issues will also be discussed to sensitisize the audience to the real-world reliability problems faced when shipping products in the most advanced technologies. About the Speaker Yongsheng Sun received the B.S and M.S degree in Microelectronics from the University of Electronic ...

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Aging Models for Analog Circuit Level Simulations – Integration and Deployment Challenges

Overview In the analog circuit design domain Spice simulators are the most commonly used tools for design exploration and verification. Consequentially an integration of add-on models for aging effects like BTI and HCI using one of several available interfaces is considered a straightforward enhancement allowing to address reliability analysis and verification. This talk will give an outline of all the not-so-straightforward challenges arising from the integration and deployment of complex aging models in the harsh environmental conditions of state-of-the-art EDA tool ecosystems. About the Speaker Peter Rotter was born in Germany in 1965. He received the diploma degree in physics from the University of Regensburg ...

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