The proceedings of the workshop are available through Open Proceedings at this link : http://ceur-ws.org/Vol-1566
The workshop program can be downloaded : ERMAVSS_Program.
Invited Talks
The Resilience Wall: Cross-Layer Solutions
Summary Resilience to hardware failures is essential for a large class of future computing systems that are constrained by the so-called power wall: from embedded systems to supercomputers. To overcome this major challenge, we advocate and examine a cross-layer resilience approach. Two major components of this approach are: 1. System- and software-level effects of circuit-level faults are considered from early stages of system design; and, 2. resilience techniques are implemented across multiple layers of the system stack – from circuit and architecture levels to runtime and applications – such that they work together to achieve required degrees of resilience in a ...
Reliability and Safety Challenges of Automotive Devices
Summary Recent years, to enhance automotive functionalities for more driving enjoyment and hazard prevention, more and more electronic devices are used to monitor and control automotive operation. To ensure the safety of drivers and passengers, these electronic devices need higher reliability. In this talk, we will present what Mentor Graphics are doing to prepare for these reliability and safety challenges in pre-silicon, post-silicon and system operations. About the Speaker Wu-Tung Cheng is a Chief Scientist and Advanced Test Research Director in Mentor Graphics. He is an IEEE fellow since year 2000. He has over 150 publications and 50 patents in semiconductor manufacture test and diagnosis area. In 2006, ...
Accuracy versus Breadth in Cross-Layer Solutions
Robert C. Aitken is an ARM Fellow and technology lead for ARM Research. His areas of responsibility include technology roadmapping, library architecture for advanced process nodes, and low power design. His research interests include design for variability, resilient computing, and memory robustness. His group has participated in numerous chip tape-outs, including 8 at or below the 16nm node. He has published over 70 technical papers, on a wide range of topics. Dr. Aitken joined ARM as part of its acquisition of Artisan Components in 2004. Prior to Artisan, he worked at Agilent and HP. He has given tutorials and ...
Reliability Challenges for Large ASICs
In this talk, Yongsheng Sun(孙 永生), will introduce HiSilicon (海思) and describe their cutting edge products. HiSilicon is one of the largest fabless companies and currently ships chips in the most advanced process technologies. Due to their success and huge number of products being shipped, reliability is a top concern. Sarinda Wang will describe the key challenges when designing highly reliable, silicon intenstive products. Specific issues will also be discussed to sensitisize the audience to the real-world reliability problems faced when shipping products in the most advanced technologies. About the Speaker Yongsheng Sun received the B.S and M.S degree in Microelectronics from the University of Electronic ...